Patent attributes
A semiconductor device includes a first wiring board having a first surface mounted with a primary radiator, and a second surface mounted with a semiconductor chip, a second wiring board mounted with a secondary radiator that forms an antenna with the primary radiator, and a third wiring board, arranged between the first and second wiring boards, and forming a predetermined gap with each of the first and second wiring boards. A first board-to-board connection member is arranged between the first and third wiring boards, to form a space between the first and third wiring boards, and regulate the spacing between the first and third wiring boards. A second board-to-board connection member is arranged between the second and third wiring boards, to form a space between the second and third wiring boards, and regulate a spacing between the second and third wiring boards.
