Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 31, 2022
Patent Application Number
17121174
Date Filed
December 14, 2020
Patent Citations
Patent Citations Received
Patent Primary Examiner
According to some embodiments, the present disclosure provides a method for determining wafer inspection parameters. The method includes identifying an area of interest in an IC design layout, performing an inspection simulation on the area of interest by generating a plurality of simulated optical images from the area of interest using a plurality of optical modes, and selecting, based on the simulated optical images, at least one of the optical modes to use for inspecting an area of a wafer that is fabricated based on the area of interest in the IC design layout.
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