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US Patent 11348882 Package spark gap structure

Patent 11348882 was granted and assigned to Intel on May, 2022 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Veronica Aleman Strong0

Adel A. Elsherbini0

Aleksandar Aleksov0

Feras Eid0

Johanna M. Swan0

Date of Patent

May 31, 2022

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Patent Application Number

166831250

Date Filed

November 13, 2019

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Patent Citations Received

US Patent 11676918 Electrostatic discharge protection in integrated circuits

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Patent Primary Examiner

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CPC Code

H01L 2224/13139

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H01L 2224/13147

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H01L 2924/15174

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H01L 2224/16225

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H01L 2924/15311

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Embodiments may relate to a microelectronic package with an electrostatic discharge (ESD) protection structure within the package substrate. The ESD protection structure may include a cavity that has a contact of a signal line and a contact of a ground line positioned therein. Other embodiments may be described or claimed.

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