US Patent 11351791 Logic circuitry package

A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.