US Patent 11354483 Parasitic representation of large scale IC packages and boards

Improved parasitic analysis of a design of an electrical circuit (e.g. a PCB coupled to an IC package) can use a first parasitic analysis to identify a first set of pins having excessive parasitic values (“hotspots” in the design) and then identify a second set of pins that do not have excessive parasitic values. The pins in the second set can be clustered (e.g. using a grid of cells) to reduce a model size for calculations in a second parasitic analysis, and the pins in the first set can be analyzed in the second parasitic analysis either individually or in clusters of similar pins with excessive parasitic values.