Patent attributes
A microwave or radio frequency (RF) device includes a substrate including an electrically insulating material. The substrate has a first surface and a second surface parallel to the first surface. The device further includes a RF component disposed over the first surface of the substrate. The device also includes a conductive layer disposed over the second surface of the substrate, the conductive layer forming a ground plane electrically insulated from the RF component. The device further includes a defected ground structure disposed on a surface of the substrate that is coplanar with the first surface, where the defected ground structure is electrically connected to the conductive layer, and where the defected ground structure includes a plurality of laterally extending members adjacent to the RF component and extending laterally in relation to the RF component.
