Patent 11356752 was granted and assigned to CommScope on June, 2022 by the United States Patent and Trademark Office.
A telecommunications panel includes a panel frame and a ground wire secured to the panel frame. The ground wire extends longitudinally along the panel frame. The ground wire may be arranged such that modular jacks presses against the ground wire when the modular jacks are received in the panel frame. The ground wire can be made of a tin plated conductive material.