Patent attributes
The disclosure belongs to a technical field related to metamaterials and discloses a multi-scale three-dimensional pentamode metamaterial and an additive manufacturing method thereof. The multi-scale three-dimensional pentamode metamaterial has a body centered cubic (BCC) structure and includes a plurality of rods and a plurality of node structures. Two ends of each of the rods are connected to the node structures. Each of the rods has a cylindrical shape and is provided with a biconical through hole. From one end of the rod towards the other end of the rod, a diameter of the biconical through hole gradually decreases and then gradually increases. A chamber is formed inside each of the node structures, the biconical through hole communicates with the chamber, and the chamber is filled with a lattice structure.
