US Patent 11359091 Polyamide molding compound

The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.