US Patent 11362128 Electronic device package and fabricating method thereof
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Patent Inventor Names
Jin Young Kim0
Ju Hoon Yoon0
No Sun Park0
Se Woong Cha0
Seung Jae Lee0
Sung Kyu Kim0
Yoon Joo Kim0
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Patent Number
113621280
Date of Patent
June 14, 2022
0Patent Application Number
169078600
Date Filed
June 22, 2020
0Patent Citations
Patent Primary Examiner
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US Patent 11362128 Electronic device package and fabricating method thereof
Article
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
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Patent jurisdiction
Patent number
11362128
Date of patent
June 14, 2022
Patent application number
16907860
Date Filed
June 22, 2020
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