US Patent 11367718 Layout for measuring overlapping state
Patent 11367718 was granted and assigned to Winbond on June, 2022 by the United States Patent and Trademark Office.
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Edits on 16 Oct, 2023
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Patent Inventor Names
Chi-Hung Chan0
Chun-Chiao Tseng0
Hung-Ming Su0
Edits on 6 Apr, 2023
Golden AI
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Edits on 22 Jun, 2022
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US Patent 11367718 Layout for measuring overlapping state
Article
A layout for measuring an overlapping state includes a layout region, a first dummy active area region, and dummy component regions. The first dummy active area region is located in the layout region. The dummy component regions are stacked in the layout region. At the moment when one of the dummy component regions is formed on the first dummy active area region, the one of the dummy component regions and the first dummy active area region have a first overlapping region, and the first overlapping region does not include other dummy component regions among the dummy component regions.
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
11367718
Date of patent
June 21, 2022
Patent application number
17124390
Date Filed
December 16, 2020
Patent primary examiner
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