US Patent 11370080 Polishing head for holding substrate and substrate processing apparatus

To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.