Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 28, 2022
Patent Application Number
17153004
Date Filed
January 20, 2021
Patent Citations
Patent Primary Examiner
A stem for a semiconductor package, includes a plate, a frame, positioned on an outer periphery of the plate in a plan view, and bonded to the plate, and a lead terminal held in a state insulated from the plate and the frame. The plate protrudes from a top surface and a bottom surface of the frame, and a protruding amount of the plate from the top surface and a protruding amount of the plate from the bottom surface are the same.
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