Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Wei Chen0
Jie Chen0
Der-Chyang Yeh0
Chi-Hsi Wu0
Date of Patent
June 28, 2022
0Patent Application Number
169893120
Date Filed
August 10, 2020
0Patent Citations Received
Patent Primary Examiner
An embodiment is a method including forming a first passive device in a first wafer, forming a first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in the first dielectric layer, planarizing the first dielectric layer and the first plurality of bond pads to level top surfaces of the first dielectric layer and the first plurality of bond pads with each other, hybrid bonding a first device die to the first dielectric layer and at least some of the first plurality of bond pads, and encapsulating the first device die in a first encapsulant.
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