US Patent 11373972 Microelectronic structures including bridges
Patent 11373972 was granted and assigned to Intel on June, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Anurag Tripathi0
Mohit Bhatia0
Nitin A. Deshpande0
Omkar G. Karhade0
Steve Cho0
Takeshi Nakazawa0
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Patent Applicant
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Patent Number
113739720
Date of Patent
June 28, 2022
0Patent Application Number
169028870
Date Filed
June 16, 2020
0Patent Citations
Patent Primary Examiner
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US Patent 11373972 Microelectronic structures including bridges
Article
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11373972
Date of patent
June 28, 2022
Patent application number
16902887
Date Filed
June 16, 2020
Patent primary examiner
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