US Patent 11375609 Method of manufacturing radio frequency interconnections
Patent 11375609 was granted and assigned to Raytheon on June, 2022 by the United States Patent and Trademark Office.
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Edits on 16 Oct, 2023
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Patent Inventor Names
Andrew R. Southworth0
James E. Benedict0
John P. Haven0
Semira M. Azadzoi0
Thomas V. Sikina0
Edits on 23 Sep, 2022
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
113756090
Date of Patent
June 28, 2022
0Patent Application Number
170915850
Date Filed
November 6, 2020
0Patent Citations
Patent Primary Examiner
Edits on 22 Sep, 2022
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Edits on 29 Jun, 2022
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Article (+441 characters)
US Patent 11375609 Method of manufacturing radio frequency interconnections
Article
A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11375609
Date of patent
June 28, 2022
Patent application number
17091585
Date Filed
November 6, 2020
Patent citations
Patent primary examiner
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