US Patent 11377749 Electrodeposition of high damping magnetic alloys
Patent 11377749 was granted and assigned to Seagate Technology on July, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Hilton Erskine0
Jie Gong0
John A. Rice0
Michael C. Kautzky0
Steven C. Riemer0
Xuelian Xu0
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Patent Number
113777490
Date of Patent
July 5, 2022
0Patent Application Number
167059910
Date Filed
December 6, 2019
0Patent Citations Received
Patent Primary Examiner
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US Patent 11377749 Electrodeposition of high damping magnetic alloys
Article
A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11377749
Date of patent
July 5, 2022
Patent application number
16705991
Date Filed
December 6, 2019
Patent primary examiner
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