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US Patent 11380619 Semiconductor devices including cobalt alloys and fabrication methods thereof

Patent 11380619 was granted and assigned to Tohoku University on July, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Tohoku University
Tohoku University
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Current Assignee
Tohoku University
Tohoku University
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
113806190
Patent Inventor Names
Junichi Koike0
Reza Arghavani0
Date of Patent
July 5, 2022
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Patent Application Number
169416850
Date Filed
July 29, 2020
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Patent Primary Examiner
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Monica D Harrison
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CPC Code
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H01L 27/0688
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H01L 29/16
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H01L 2224/45157
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H01L 2924/13091
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H01L 27/06
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H01L 24/45
0

A semiconductor device includes a substrate, a conductive wiring which comprises cobalt or copper and is electrically connected to the substrate, an insulating material which electrically isolates the conductive wiring from neighboring wiring, and a first barrier layer which comprises a first cobalt alloy and is disposed between the conductive wiring and the insulating material.

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