US Patent 11380653 Die stack structure and manufacturing method thereof
Patent 11380653 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 16, 2020
0
Date of Patent
July 5, 2022
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Patent Application Number
16903370
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Patent Citations
Patent Inventor Names
Chen-Hua Yu
0
Tzuan-Horng Liu
0
Sung-Feng Yeh
0
Ming-Fa Chen
0
Hsien-Wei Chen
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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