Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 5, 2022
Patent Application Number
15939806
Date Filed
March 29, 2018
Patent Citations
Patent Citations Received
Patent Primary Examiner
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
