US Patent 11387163 Scalable debris-free socket loading mechanism
Patent 11387163 was granted and assigned to Intel on July, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Andrew Larson0
Bijoyraj Sahu0
Craig J. Jahne0
Eric W. Buddrius0
Ralph V. Miele0
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Patent Number
113871630
Date of Patent
July 12, 2022
0Patent Application Number
159422780
Date Filed
March 30, 2018
0Patent Citations
Patent Primary Examiner
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US Patent 11387163 Scalable debris-free socket loading mechanism
Article
A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11387163
Date of patent
July 12, 2022
Patent application number
15942278
Date Filed
March 30, 2018
Patent citations
Patent primary examiner
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