Patent attributes
A semiconductor device according to an embodiment comprises a first chip and a second chip. The first chip includes a first wire, a first connection pad electrically connected to the first wire, and a first dummy pad. The second chip includes a second wire, a second connection pad electrically connected to the second wire and joined to the first connection pad, and a second dummy pad joined to the first dummy pad. A thickness of the first dummy pad is smaller than a thickness of the first connection pad and a thickness of the second dummy pad is also smaller than a thickness of the second connection pad, or the thickness of the first dummy pad is smaller than the thickness of the first connection pad or the thickness of the second dummy pad is smaller than the thickness of the second connection pad.