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US Patent 11398495 Semiconductor devices
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Patent
Date Filed
March 31, 2020
Date of Patent
July 26, 2022
Patent Applicant
Samsung
Patent Application Number
16836010
Patent Citations
US Patent 10256248 Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof
US Patent 10249640 Within-array through-memory-level via structures and method of making thereof
US Patent 10269620 Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11398495
Patent Primary Examiner
Christopher A Johnson
CPC Code
H01L 27/11582
H01L 27/11578
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