US Patent 11399434 Electronic package and method of forming an electronic package

Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector module and the second connector module, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.