US Patent 11401749 Cutting element with reduced friction
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Edits on 16 Oct, 2023
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Patent Inventor Names
Chris Cheng0
Jianhua Guo0
Jiaqing Yu0
Jie Li0
Xihui Hu0
Yonghong Wang0
Edits on 6 Apr, 2023
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Patent Number
114017490
Date of Patent
August 2, 2022
0Patent Application Number
169174490
Date Filed
June 30, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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Edits on 3 Aug, 2022
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Article (+510 characters)
US Patent 11401749 Cutting element with reduced friction
Article
A cutting element comprises a cylindrical substrate, a table bonded to the substrate, a working surface on the top of the table, and a plurality of dimples on the working surface. The table is made of super-abrasive material. The super-abrasive material can be PCD. Surface patterns of the table can reduce contact friction between the rock and the cutting element. Therefore, heat on the table can be reduced and thermal damage to the table is decreased. This results in improved cutting element service life.
Infobox
Is a
Patent jurisdiction
Patent number
11401749
Date of patent
August 2, 2022
Patent application number
16917449
Date Filed
June 30, 2020
Patent citations
Patent primary examiner
CPC Code
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