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US Patent 11403241 Communicating data with stacked memory dies
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Is a
Patent
Current Assignee
Micron Technology
Date Filed
May 11, 2018
Date of Patent
August 2, 2022
Patent Applicant
Micron Technology
Patent Application Number
15977818
Patent Citations
US Patent 10185499 Near-memory compute module
US Patent 10281067 High pressure fitting
US Patent 10381067 Memory system topologies including a buffer device and an integrated circuit memory device
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11403241
Patent Primary Examiner
Chun Kuan Lee
CPC Code
G06F 13/42
G11C 5/06
G11C 5/02
G11C 11/225
G11C 5/063
G11C 7/1012
G11C 7/1069
G11C 11/4093
G11C 11/4096
G11C 5/04
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