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US Patent 11406041 Modular liquid cooling assembly

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 26, 2020
Date of Patent
August 2, 2022
Patent Application Number
16831411
Patent Citations
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US Patent 10014239 Information processing device and cooling unit
0
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US Patent 10136554 Passive two-phase cooling with forced cooling assist
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US Patent 10244655 Two-phase liquid cooled electronics
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US Patent 10499543 Two-phase liquid cooled electronics
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US Patent 10455733 Liquid cooling system and method
0
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US Patent 11019752 Cooling module design for servers
0
‌
US Patent 10966354 Liquid cooling module
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US Patent 10701832 Two-phase liquid cooled electronics
0
Patent Citations Received
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US Patent 11997832 System for cooling server boards in a data center
0
Patent Inventor Names
Steve Qingjun Cai
0
Unnikrishnan Vadakkanmaruveedu
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11406041
Patent Primary Examiner
‌
Robert J Hoffberg
CPC Code
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H05K 7/20772
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H05K 7/20836
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H05K 7/20281
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G06F 1/206
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H05K 7/20272
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F28D 15/00

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