US Patent 11410836 Analysis method and semiconductor etching apparatus
Patent 11410836 was granted and assigned to Hitachi on August, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 21, 2019
0
Date of Patent
August 9, 2022
0
Patent Applicant
Patent Application Number
16281652
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Patent Citations
Patent Citations Received
Patent Inventor Names
Akira Kagoshima
0
Ryoji Asakura
0
Kenji Tamaki
0
Daisuke Shiraishi
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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