Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2022
Patent Application Number
16751139
Date Filed
January 23, 2020
Patent Citations
Patent Citations Received
Patent Primary Examiner
A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.
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