Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2022
Patent Application Number
16357053
Date Filed
March 18, 2019
Patent Primary Examiner
A heat spreader is disclosed with regions where material is absent to reduce the mass/weight of the heat spreader without substantially reducing the temperature of the semiconductor chip and without substantially affecting the warpage and mechanical stress/strain in the electronic package.
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