Patent attributes
An integrated circuit (IC) device includes a peripheral circuit structure, a memory stack including a plurality of gate lines overlapping the peripheral circuit structure in a vertical direction on the peripheral circuit structure, an upper substrate between the peripheral circuit structure and the memory stack, the upper substrate including a through hole positioned below a memory cell region of the memory stack, a word line cut region extending lengthwise in a first lateral direction across the memory stack and the through hole, and a common source line located in the word line cut region, the common source line including a first portion extending lengthwise in the first lateral direction on the upper substrate and a second portion integrally connected to the first portion, the second portion penetrating the upper substrate through the through hole from an upper portion of the upper substrate and extending into the peripheral circuit structure.
