US Patent 11411032 Sensor chip and electronic device
Patent 11411032 was granted and assigned to Sony Semiconductor Solutions Corporation on August, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Akira Tanaka0
Toshifumi Wakano0
Yusuke Otake0
Edits on 3 Apr, 2023
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Edits on 10 Aug, 2022
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US Patent 11411032 Sensor chip and electronic device
Article
An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
11411032
Date of patent
August 9, 2022
Patent application number
16864380
Date Filed
May 1, 2020
Patent citations
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