US Patent 11414573 Adhesive composition
All edits
Edits on 1 Nov, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 16 Oct, 2023
Golden AI
Edits made to:
Infobox (+5 properties)
Infobox
Patent Inventor Names
Satoru Matsumoto0
Takahiro Fukui0
Tatsuya Kumada0
Tetsuyuki Shirakawa0
Yusuke Asakawa0
Edits on 26 Mar, 2023
Golden AI
Infobox
Is a
Patent Applicant
Patent Jurisdiction
Patent Number
114145730
Date of Patent
August 16, 2022
0Patent Application Number
163289440
Date Filed
August 29, 2017
0Patent Primary Examiner
Edits on 17 Aug, 2022
Golden AI
Edits made to:
Infobox (+17 properties)
Article (+541 characters)
US Patent 11414573 Adhesive composition
Article
One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
Infobox
Is a
Patent Applicant
Patent Jurisdiction
Patent Number
11414573
Date of Patent
August 16, 2022
Patent Application Number
16328944
Date Filed
August 29, 2017
Patent Primary Examiner
Find more entities like US Patent 11414573 Adhesive composition
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
