US Patent 11416977 Self-measurement of semiconductor image using deep learning

Methods, systems, and non-transitory computer readable medium are described for automated image measurement for process development and optimization. An example method may include receiving an image of a product associated with a manufacturing process, wherein the product comprises a plurality of structures; identifying, using a trained machine learning model, a segment of the image that comprises a structure of the plurality of structures; determining a plurality of image measurements of the segment that comprises the structure; and storing the plurality of image measurements.