Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Maju Tomura0
Ryutaro Suda0
Takahiro Yokoyama0
Takatoshi Orui0
Yoshihide Kihara0
Date of Patent
August 16, 2022
0Patent Application Number
169304830
Date Filed
July 16, 2020
0Patent Citations
Patent Primary Examiner
An etching method of an exemplary embodiment involves providing a substrate in a chamber of a plasma treatment system. The substrate includes a silicon-containing film. The method further involves etching the silicon-containing film by a chemical species in plasma generated from a process gas in the chamber. The process gas contains a halogen gas component and phosphorous gas component.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.