US Patent 11417792 Interconnect with nanotube fitting
Patent 11417792 was granted and assigned to Meta on August, 2022 by the United States Patent and Trademark Office.
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Patent Citations Received
Edits on 16 Oct, 2023
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Patent Inventor Names
Ali Sengül0
Daniel Brodoceanu0
Jeb Wu0
Oscar Torrents Abad0
Tennyson Nguty0
Zheng Sung Chio0
Edits on 23 Mar, 2023
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Edits on 26 Sep, 2022
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Patent Citations
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US Patent 11417792 Interconnect with nanotube fitting
Article
A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
11417792
Date of Patent
August 16, 2022
Patent Application Number
16824567
Date Filed
March 19, 2020
Patent Citations
Patent Primary Examiner
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