Patent attributes
The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.
