Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Aleksandar Aleksov0
Adel A. Elsherbini0
Veronica Aleman Strong0
Johanna M. Swan0
Feras Eid0
Date of Patent
August 23, 2022
0Patent Application Number
167242570
Date Filed
December 21, 2019
0Patent Citations Received
Patent Primary Examiner
Embodiments may relate to a package substrate that is to couple with the die. The package substrate may include a signal line that is communicatively coupled with the die. The package substrate may further include a conductive line. The package substrate may further include a diode communicatively coupled with the signal line and the conductive line. Other embodiments may be described or claimed.
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