Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11424367 Wrap-around contacts including localized metal silicide

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 16, 2020
0
Date of Patent
August 23, 2022
0
Patent Application Number
17124458
0
Patent Citations
‌
US Patent 10497792 Contacts for highly scaled transistors
‌
US Patent 10193090 Method of manufacturing a semiconductor device and a semiconductor device
‌
US Patent 10236218 Methods, apparatus and system for forming wrap-around contact with dual silicide
0
‌
US Patent 10276442 Wrap-around contacts formed with multiple silicide layers
‌
US Patent 10361277 Low resistivity wrap-around contacts
‌
US Patent 10680062 III-V semiconductor layers, III-V semiconductor device and methods of manufacturing thereof
‌
US Patent 10424651 Forming nanosheet transistor using sacrificial spacer and inner spacers
Patent Inventor Names
Eric Miller
0
Yann Mignot
0
Andrew M. Greene
0
Julien Frougier
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11424367
0
Patent Primary Examiner
‌
David C Spalla
0
CPC Code
‌
H01L 27/1211
0
‌
H01L 29/0642
0
‌
H01L 29/0649
0
‌
H01L 29/0653
0
‌
H01L 29/0665
0
‌
H01L 29/0669
0
‌
H01L 29/0673
0
‌
H01L 29/41791
0
‌
H01L 29/66439
0
‌
H01L 29/6653
0
•••

Find more entities like US Patent 11424367 Wrap-around contacts including localized metal silicide

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo