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US Patent 11431365 Radio frequency module and communication device
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Patent
Date Filed
March 22, 2021
Date of Patent
August 30, 2022
Patent Application Number
17207756
Patent Citations
US Patent 10659121 Apparatus and methods for radio frequency front-ends
0
US Patent 10396753 Stacked wafer-level packaging devices
0
Patent Inventor Names
Yukiya Yamaguchi
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11431365
Patent Primary Examiner
Quochien B Vuong
CPC Code
H04B 1/006
H04B 1/0067
H04B 1/02
H04B 1/04
H04B 1/0458
H04B 1/0483
H04B 1/40
H04B 1/406
H04B 2001/0408
H04B 2001/0416
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