US Patent 11433474 Ultrasonic bonding method
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Patent Inventor Names
Akihiro Ichinose0
Hiroshi Kobayashi0
Yoshihito Yamada0
Edits on 30 Mar, 2023
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US Patent 11433474 Ultrasonic bonding method
Article
In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed V
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Patent Jurisdiction
Patent Number
11433474
Date of Patent
September 6, 2022
Patent Application Number
16630875
Date Filed
March 13, 2019
Patent Citations
Patent Primary Examiner
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