US Patent 11437262 Wafer de-chucking detection and arcing prevention
Patent 11437262 was granted and assigned to Applied Materials on September, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 12, 2018
0
Date of Patent
September 6, 2022
0
Patent Applicant
Patent Application Number
16217768
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Patent Citations Received
Patent Inventor Names
Byung Chul Yoon
0
Ganesh Balasubramanian
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Hemant Mungekar
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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