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US Patent 11444036 Power module assembly
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Is a
Patent
Date Filed
January 22, 2021
Date of Patent
September 13, 2022
Patent Application Number
17155956
Patent Citations
US Patent 10658324 Semiconductor device
US Patent 10096562 Power module package
Patent Citations Received
US Patent 12136623 Multi-device semiconductor chip with electrical access to devices at either side
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11444036
Patent Primary Examiner
Hoa C Nguyen
CPC Code
H05K 1/141
H05K 7/1432
H05K 7/1457
H05K 7/1482
H05K 1/0296
H05K 13/0885
H01L 23/5385
H01L 23/66
H05K 7/1492
H05K 1/145
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