Patent attributes
Embodiments promote the maintenance of a designed flow of cooling air through a chassis during the servicing of one or more electronic components contained by the chassis. A top opening created by the removal of server chassis from a rack may be significantly reduced by internal lids that provide access to groups of components. Gaps created by the partial removal of groups of components may be significantly reduced by air dams attached to the components that inhibit the flow of air between the components. And the opening created by the removal of a circuit board may be significantly reduced by a flap configured to cover the opening upon removal of the circuit board. The various embodiments may be used individually or in combination to reduce openings in the chassis that may allow air to flow in paths that negatively affect the designed air flow.
