Patent attributes
A defect identification method and an image analysis system are provided. The defect identification method includes the following steps: adjusting a gray level distribution of a first image corresponding to a reference image of a defect on a wafer to generate a second image; capturing a defect of interest image in the second image; analyzing a plurality of pixels of the defect of interest image to obtain a minimum gray level value of the pixels; analyzing the pixels of the second image according to the minimum gray level value, so as to obtain a number of defect of interest pixels and a number of non-defect of interest pixels; dividing the number of defect of interest pixels by the number of non-defect of interest pixels to obtain a proportional value; and determining a defect type of the defect in the first image according to the proportional value.
