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US Patent 11450736 Source/drain regions in integrated circuit structures

Patent 11450736 was granted and assigned to Intel on September, 2022 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
Intel
Intel
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Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114507360
Patent Inventor Names
Andy Chih-Hung Wei0
Guillaume Bouche0
Sean T. Ma0
Date of Patent
September 20, 2022
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Patent Application Number
168293570
Date Filed
March 25, 2020
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Patent Citations
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US Patent 11069813 Localized heating in laser annealing process
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US Patent 10847656 Fabrication of non-planar IGZO devices for improved electrostatics
Patent Primary Examiner
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Nicholas J Tobergte
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CPC Code
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H01L 29/0653
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H01L 24/43
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Disclosed herein are source/drain regions in integrated circuit (IC) structures, as well as related methods and components. For example, in some embodiments, an IC structure may include: an array of channel regions, including a first channel region and an adjacent second channel region; a first source/drain region proximate to the first channel region; a second source/drain region proximate to the second channel region; and an insulating material region at least partially between the first source/drain region and the second source/drain region.

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