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US Patent 11452237 Liquid cooling interconnect module of a computing system
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Current Assignee
Hewlett Packard Enterprise
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Date Filed
October 16, 2020
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Date of Patent
September 20, 2022
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Patent Applicant
Hewlett Packard Enterprise
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Patent Application Number
17073090
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Patent Citations
US Patent 11064628 Rack adapted for receiving a component and system including the rack and the component
US Patent 10791654 Multi-purpose coolant interface
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US Patent 10164373 Automatic engagement system for liquid or power connections
US Patent 10188016 Node blind mate liquid cooling
US Patent 10405458 Fitting assembly and electronic device
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US Patent 10701838 Self-installing connections for rack liquid cooling
US Patent 10734760 Magnetic fluid connector
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11452237
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Patent Primary Examiner
Courtney L Smith
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