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US Patent 11462418 Integrated circuit package and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 17, 2020
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Date of Patent
October 4, 2022
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
16745610
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Patent Citations
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US Patent 11315891 Methods of forming semiconductor packages having a die with an encapsulant
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US Patent 10522470 Package structure and method of fabricating the same
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US Patent 11309225 Fan-out package structure and method of manufacturing the same
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US Patent 11322450 Chip package and method of forming the same
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Patent Citations Received
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US Patent 11916353 Electronic chip support device and corresponding manufacturing method
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Patent Inventor Names
Szu-Wei Lu
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Weiming Chris Chen
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Chi-Hsi Wu
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Kuo-Chiang Ting
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Shang-Yun Hou
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Shih Ting Lin
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11462418
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Patent Primary Examiner
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Mohsen Ahmadi
0

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