US Patent 11462495 Chiplets 3D SoIC system integration and fabrication methods
Is a
Date Filed
October 22, 2020
0
Date of Patent
October 4, 2022
0
Patent Application Number
17077618
0
Patent Inventor Names
Chen-Hua Yu
0
Kuo-Chung Yee
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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