Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 4, 2022
Patent Application Number
17076063
Date Filed
October 21, 2020
Patent Citations
Patent Primary Examiner
CPC Code
An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
